Contact Angle & Surface Tension Analyzer   Phoenix300

    Contact angle is a well-known technique for investigating and controlling adhesion, surface treatments and cleaning, and polymer film modification.
    The wetting of solid substrates is a basic feature of many natural and industrial processes and contact angle is a simple, rapid, and sensitive method of characterizing the wettability of a solid surface. A computer controlled contact angle analyzer makes it easy to measure static and dynamic contact angle, along with surface tension and surface energy.

    The position of the sample stage can be precisely adjusted along the x-, y-, or z-axis.
    An optical system using variable intensity illumination controls the degree of backlighting.
    The optics can be tilted by up to 3degree allowing you to choose the angle of view required for rough or uneven surfaces.
    The instrument uses a stepping motor controlled syringe system for precise and repeatable liquid drop formation and application. This insures that a reproducible drop volume is applied to the surface.

    Operator safety is maximized by the avoidance of any exposed electrical wiring.

    Applications :

     1. Detection of organic contamination on a PCB or electronic components.
     2. Hydrophobicity and hydrophilicity of solid surfaces
     3. Biological application such as the detection and characterization of proteins
     4. Conversion of Contact Angle Data to Surface Energies
     5. Analysis of plasma treatments to increase the wettability on polymers surfaces

    advantages

     1. Automatic and rapid sample analysis and high-speed dynamic image capture.
     2. Improved precision and reproducibility by the elimination of operator error.
     3. Measurement of surface tension and static/dynamic contact angle.
     4. Calculation of surface energy and work of adhesion by the following


      Methods: Girifaleo-Good-Fowkes-Young, Owens-Wendt Geometric Mean, Wu Harmonic Mean, and Lewis Acid/Base.

    Specifications

    Name

    Phoenix 300

    Unit size(L*H*W) in mm

    660*560*270

    Weight

    28 kg

    Max. Sample size(L*H*W)in mm

    200×50סÄ

    Zoom

    6.4 fold

    Focus

    Internal, ±6 mm

    Resolution

    768 × 576 NTSC, 16M color

    Max measuring speed

    30 images/s

    Dispensing type

    Automatic (Using a controllable step moter)

    Light source

    Adjustable rear lamp

    Operating system

    Windows 95/ 98/ Me/ NT/ 2000

    Evaluation methods

    Static/Dynamic contact angles

    Pendant drop analysis

    Surface Energy

    Continuation capture images

    Contact angle

    0 ~ 180 °, ±0.1° accuracy

    Surface and interfacial tension

    10-1~103 mN/m Resolution ±0.05 mN/m

    Temperature measurement

    External

    Accessories

    Guide book, Styring and tip set, level, tweezers

    Extra Fuse and lamp, Tool box, Dust cover, etc.,

    Options

    Completed setup computer.

    Thermal chamber (RT to 350°)

    Thermal pad (RT to 350°)

    Sample stage for 8"/12" wafers

 Send your inquiryInquiry form

 E-mail: lab@labkorea.com

ESEL TECHTRA INC..

 #1382-4, Kuweol-3dong, Namdongku, Incheon, korea

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