Wafer Surface Analysis System
Throughout the semiconductor manufacturing process, the
VCA-3000™ systems offer quick and accurate analysis of wafer
surface conditions so process quality is assured before applying to
large amounts of production wafers.
The VCA-3000 systems incorporate computerized video imaging with
contact angle analysis to evaluate wafer surface conditions. The
contact angle is defined by the tangent created at the interface of a
liquid droplet with the wafer surface. It is directly related to the
phenomenon of surface energy which is a critical factor for adhesion,
cleanliness evaluation and coating assessment.
Applications include:
- Coating assessment of the HMDS process
- Surface contamination detection
- Adhesive and primer preparation
- Coating uniformity
- Coating quality
Features
VCA-3000 Family Product Features
