CAM-Wafer: Product Info | Specifications

Contact Angle Measurements of Larger Surface Areas - Tantec CAM-WAFER

Contact Angle Meters for measuring large critical surface areas such as semiconductor wafers, CD’s, hard disks or LD’s tend to be either unwieldy to use or are expensive instruments. Tantec’s CAM-WAFER simplifies measurements while making it affordable instrument packaging. This QC tool is designed for determining surface cleanliness, the presence of photoresist, etching rates, predicting adhesion or predicting electrical connections. The Tantec CAM-WAFER is designed for quick, error-free measurements for QC or process development purposes.

Contact angle used to characterize surfaces for adhesion and coating experiments

The contact angle of a liquid on a solid surface is defined as the angle between a substrate surface and the tangent line at the point of contact of the liquid droplet liquid/solid/gas interface. When a liquid droplet (usually water for testing and consistency) is set on a smooth homogenous surface, the resulting contact angle reaches an equilibrium value within a few seconds. That value depends on the forces acting on the droplet including: what kind of surface is being contacted and the "cleanliness" of that surface. Surfaces which are more highly wettable result in smaller contact angles. This contact angle can then be used for statistical process control means.

 Product description

Tantec’s CAM-WAFER simplifies the measuring of large surfaces with several advances in contact angle meter design. A projection screen placed right in front of the operator allows for a large droplet image at viewing height for simple, repeatable measurements which can then be discussed in a group. Tantec’s patented Half-Angle ™ measuring approach allows for unambiguous repeatable measurements. A dual axis stage control with digital readout allows for PCB, CD, LD hard disks or wafer mapping of the same points based on a sampling plan. Stages can be easily changed from 4 up to 8" in diameter allowing for maximum measuring flexibility. A simple touch pivot arm gently applies the droplet to the surface to be measured, thereby eliminating another variability and measurement error source. A reservoir filled with the test liquid can fill the syringe by the simple flip of a 3-way valve - eliminating the need to remove the micro syringe when charging of the test liquid is required.. All of these features are what you have asked for in this type of measuring instrument.

Features

Half-Angle^TM Measuring Method

The Tantec Half-Angle ^TM (US Patent No. 5,268,733) measuring method allows you to take direct "Half Angle" measurements eliminating errors associated with arbitrary tangential alignment of a hair line to the droplet image.  This technique is based on the  formula  for determining contact  angle  from the droplet dimensions.  The contact angle is easily and unequivocally determined by directly reading the scale on the screen. Both this arbitrary tangent line approach as well as errors associated with operator parallax are eliminated using this technique.

Projection Screen vs. Microscope-Based Design

The use of a projection screen placed right in front of the operator makes it possible for more than one person to observe the droplet. It is good for discussion purposes and helps to detect process problems through easy supervision. Compare this to ocular/microscope-based designs which allow for only one operator at a time to view the sample.

Cost Effectiveness
Lens Relay System vs. Digital Imaging System

By eliminating the costs associated with the more complex digital imaging systems, the CAM-WAFER has made contact angle measurements more affordable. The CAM-WAFER offers reliable, repeatable measurements for QC purposes without the cost of more sophisticated imaging systems - a cost which will fit your budget constraints.

Measured angle range:	0 deg to 180 deg
Droplet size:	adjustable, 0.5 µl min
Pipettor capacity:	0.2 ml
Magnification:	15:1
Specimen holder size:	4", 6" and 8" diameters
Smallest tested surface:	0.001 in²
Accuracy:	standard deviation 2°
Dimensions and Weight:	36" L x 24" W x 20" D, approximately 30 lbs

Applications:
* TESTING SILICONE DIOXIDE SURFACES FOR CONTAMINATION
* TESTING ETCHING RATES OF VARIOUS SURFACES OR TO INSURE ELECTRICAL CONNECTIVITY
* TESTING WAFER OR MASKS SURFACES FOR PHOTORESIST
* EVALUATING SURFACE CLEANLINESS OF HARD DISK, CD, LD, WAFER AND OTHER LARGE SURFACES
* TESTING PCB’s PRIOR TO SEALING, DIE ATTACHMENT, WIRE BONDING